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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. :Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 1/3 HMM4148 SURFACE MOUNT SWITCHING DIODES Description The HMM4148 is designed for high-speed switching application in hybrid thick-and thin-film circuits. Absolute Maximum Ratings ( Operating temperature range applies unless otherwise specified ) Characteristics Symbol Value Reverse Voltage VR 75 Peak Reverse Voltage IRM 100 Rectified Current(Average) Half Wave Rectification with Resistive Load at IO 150 Tamb=25C and f50Hz IFSM 500 Surge Forward Current at t<1s and Tj=25C Ptot 500 Power Dissipation at Tamb=25C Junction Temperature Tj 200 Storage Temperature Range Ts -65 to +200 Unit V V mA mA mW C C Characteristics ( Tj=25C) Characteristics Forward Voltage at IF=10mA Leakage Current at VR=20V VR =75V VR =20V, Tj=150C Reverse Breakdown Voltage tested with 100us Pulses Capacitance at VF= VR =0 Voltage Rise when Switching On Tested with 50mA Forward Pulses Tp=0.1us, Rise Time<30ns, fp=5~100kHz Reverse Recovery Time From IF=-IR=10mA to IRR=-1mA, VR=6V, RL=100 Thermal Resistance Function to Ambient Air Rectification Efficiency at f=100MHz, VRF=2V Symbol Min VF IR V(BR)R 100 Ctot Vfr trr RthA v 0.45 Typ Max 1 25 5 50 -4 2.5 4 Unit V nA uA uA V pF V ns 0.35 K/mW - HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Spec. No. :Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 2/3 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Dimension Spec. No. :Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 3/3 Cathode Mark A LL-34 Mini-Melf SOD-80C Inches Min. Max. 0.0512 0.0591 0.0118 0.0197 B D C *:Typical DIM A B Millimeters Min. Max. 1.30 1.50 0.30 0.50 DIM C D Inches Min. Max. 0.0118 0.0197 0.1260 0.1417 Millimeters Min. Max. 0.30 0.50 3.2 3.6 Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 30,1999 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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